Organic Electronic Solder Flux and Paste Activators
Esprix Technologies has for more than 35 years supplied customers around the world with high quality solder flux activators to make electronic solder fluxes and alloy paste formulations.
Generally the activators are used in flux/paste formulations at a concentration of 0.5% to 5% by weight. Due to the proprietary nature of this industry it is not completely understood how the activators function in individual systems.
The acid functionality of the product plays a key role in the performance. Also, the MP and the MW of the activator as they relate to when the flux mixture will melt and how long it will remain active when operating at a specific soldering temperature.
Formulations using a chloride ion normally require post solder washing to prevent corrosion. Depending on the level of the free bromide ion post solder washing may not be required to solder residue.
- Aniline Hydrochloride (HCl)
- D-Camphoric Acid
- Cyclohexylamine Hydrochloride (HCl)
- Cyclohexylamine Hydrobromide (HBr)
- DBD = 2,3-Dibromo-2-butene-1,4-Diol
- Dibromo-Styrene ((1,2-Dbromoethyl) Benzene)
- Diethyamine Hydrobromide
- Dimethylamine Hydrochloride (DMA-HCl)
- Glutaric Acid (1,3-Propanedicarboxylic Acid)
- Triethanolamine Hydrochloride (HCl)
- Triethyamine Hydrochloride (HCl)
- Mono Ethanolamine Hydrochloride (HCl) (61% solution)
